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IC Package substrate\Application CPU\ GPU\ FABGA\FCCSP IC BT resin ABF resin\CHIPLET
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Key attributes
Other attributes
Place of Origin
Guangdong, China
Brand Name
WEII FAST
Model Number
Customer customization
Mounting Type
IC package substrate
Description
IC package substrate
Min. Hole Size
0.075mm
Min. Line Width
5um
Board Thickness
0.1-1.0mm
Base Material
ABF
Min. Line Spacing
5um
Surface Finishing
HASL\ Immersion gold \Flash gold
Board Size
Solder
Application
IC
Type
BGA package substrate
Industrial
Inverter
IC
Industrial
Packaging and delivery
Selling Units:
Single item
Single package size:
2X1X1 cm
Single gross weight:
0.010 kg
Lead time
| Quantity (pieces) | 1 - 10 | > 10 |
| Lead time (days) | 15 | To be negotiated |
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 20 piece
Sample price:
$1.00/piece
Customization
Customized logo
Min. order: 20
Graphic customization
Min. order: 20
For more customization details, message supplier
Product descriptions from the supplier
>= 10 pieces
$2.80
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 20 piece
Sample price:
$1.00/piece
Membership benefits
Quick refundsView more
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